Multi-die/multi-chiplet design has thrown a wrench into the ability to manage design complexity, driving up costs per ...

Given computer vision’s place as the cornerstone of an increasing number of applications from ADAS to medical diagnosis and ...

Testing HBM; high density interconnect; SLM in aerospace and government. Cadence’s Vatsal Patel stresses the importance of ...

Samsung's GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum ...

A technical paper titled “Enhancing Functional Safety in Automotive AMS Circuits through Unsupervised Machine Learning” was published by researchers at University of Texas at Dallas, Intel Corporation ...

Overlay is becoming a significant problem in the manufacturing of semiconductors, especially in the world of advanced packaging substrates — think panels — the larger the area, the greater the ...

SE: What do engineers who have spent their careers in CMOS need to know about designing for photonics? Lamant: It’s hard, no illusion. I had good mentors, including both James and Mitch, so I actually ...

These new technical papers were recently added to Semiconductor Engineering’s library.

Researchers from the Max Planck Institute for the Science of Light and Massachusetts Institute of Technology found a way to build reconfigurable recurrent operators based on sound waves for photonic ...

“Fingerprinters leverage the heterogeneity in hardware and software configurations to extract a device fingerprint. Fingerprinting countermeasures attempt to normalize these attributes such that they ...

A technical paper titled “Metrology for 2D materials: a perspective review from the international roadmap for devices and systems” was published by researchers at Arizona State University, IBM ...